Advanced Semiconductor Packaging Market

Toward the end of forecast year 2030, the global advanced semiconductor packaging market size will reach a valuation of over US$90 Bn.

The market for advanced semiconductor packaging is all set for an impressive CAGR of 10.8% during the assessment period, 2023 - 2030.

The fan-out wafer level packaging (FAN-OUT WAFER LEVEL) continues to be the most preferred packaging type segment. By application, the consumer electronics industry is expected to remain the leading market segment throughout the years of forecast.

Asia Pacific will continue to lead the worldwide advanced semiconductor packaging industry attributing to the region’s exploding market for consumer electronics. North America on the other side is projected to display the fastest growth during the forecast period.

Some of the significant players in the worldwide advanced semiconductor packaging space include Advanced Semiconductor Engineering, Inc., Advanced Micro Devices, Inc. (AMD), Intel Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology (JCET), STMicroelectronics N.V., Hitachi Chemical, Infineon, Kyocera, China Wafer Level CSP, and Sumitomo Chemical.